Hybrid modeling techniques for multilayered printed circuit board in power electronics: association of electromagnetic methods

Hybrid modeling techniques for multilayered printed circuit board in power electronics: association of electromagnetic methods With the fast development of power electronics circuits at increasing switching frequency (over 10 MHz), the multilayered printed circuits boards (PCBs) are being used more and more in the field ofpower electronics. In this paper, two main computational methods are presented to simulate the dynamic behavior of power electronics interconnection systems. Our aim is to present a methodology to analyze the electromagnetic (EM) behavior of power PCB regarding parasitic effects ( EM couplings) or dynamic effects (impedance): a general procedure is given to calculate EM couplings between strip conductors in multilayered configurations based on the principle of hybrid methods. Finally, we propose a new method to limit computation time based on matrix sparsification.